Projects

intern

Horizon Europe: PATTERN

Full Name: Next generation ultra-high-speed microwave Photonic integrATed circuiTs using advancE hybRid iNtegration

Duration: 30/9/2022-1/10/2026

Partners:

Objective:

Photonic integrated circuits use light instead of electrons to transport signals. The EU funded PATTERN project will create the worldâ€™s first process design kit for microwave photonics at ultra-high frequencies above 100 GHz. It will also introduce new functionalities into these circuits, such as magneto-optics isolators and acousto optics modulators. To do this, researchers will integrate several different platforms, such as indium phosphide and lithium niobate, but also include new materials, such as yttrium iron garnet. The project will also develop the co integration of electronic SiGe chips with photonic integrated circuits. PATTERN will pave the way for a new generation of advanced products in a range of applications, including 5G/6G, quantum technologies, LiDAR and sensing.

International Journals

M. Niels, T. Vanackere, E. Vissers, T. Zhai, P. Nenezic, J. Declerq, C. Bruynsteen, S. Niu, A. Moerman, O. Caytan, N. Singh, S. Lemey, X. Yin, S. Janssen, P. Verheyen, N. Singh, D. Bode, M. Davi, F. Ferraro, P. Absil, S. Balakrishnan, J. Van Campenhout, G. Roelkens, B. Kuyken, M. Billet, A high-speed heterogeneous lithium tantalate silicon photonics platform, accepted for publication in Nature Photonics, (to be published).
M. Niels, E. Vissers, T. Vanackere, A. Moerman, X. Guo, P. Geerinck, E. Soltanian, J. Zhang, S. Janssen, P. Verheyen, N. Singh, D. Bode, M. Davi, F. Ferraro, P. Absil, S. Balakrishnan, J. Van Campenhout, S. Hänsch, H. Mai, N. Singh, G. Roelkens, S. Uvin, M. Billet, B. Kuyken, Demonstration of lithium niobate integration on a 200-mm silicon photonics wafer using transfer printing, Optics Letters, doi:https://doi.org/10.1364/OL.564405 (2025) .
M. Niels, T. Vanackere, T. Vandekerckhove, S. Poelman, T. Reep, G. Roelkens, M. Billet, B. Kuyken, Centimetre-Scale Micro-Transfer Printing to enable Heterogeneous Integration of Thin Film Lithium Niobate with Silicon Photonics, Optical Materials Express, 15(3), p.531-540 doi:10.1364/OME.551748 (2025) .

International Conferences

M. Niels, T. Vanackere, E. Vissers, T. Zhai, P. Nenezic, J. Declerq, C. Bruynsteen, S. Niu, A. Moerman, O. Caytan, N. Singh, S. Lemey, X. Yin, S. Janssen, P. Verheyen, N. Singh, D. Bode, M. Davi, F. Ferraro, P. Absil, S. Balakrishnan, J. Van Campenhout, G. Roelkens, B. Kuyken, M. Billet, Wafer-scale integration of lithium niobate on a silicon photonics 200-mm platform, accepted for publication in IEEE Photonics Conference, Singapore, (to be published) .
M. Niels, T. Vanackere, E. Vissers, T. Zhai, P. Nenezic, J. Declerq, C. Bruynsteen, S. Niu, A. Moerman, O. Caytan, N. Singh, S. Lemey, X. Yin, S. Janssen, P. Verheyen, N. Singh, D. Bode, M. Davi, F. Ferraro, P. Absil, S. Balakrishnan, J. Van Campenhout, G. Roelkens, B. Kuyken, M. Billet, High-speed lithium tantalate-based silicon photonic modulators, Conference on Lasers and Electro-Optics/Europe (CLEO/Europe 2025) and European Quantum Electronics Conference (EQEC 2025), Germany, doi:10.1109/CLEO/Europe-EQEC65582.2025.11111408 (2025) .