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H2020CALADAN

H2020: CALADAN

Full Name: Micro assembled Terabit/s capable optical transceivers for Datacom applications

Duration: 1/1/2019-31/12/2022

Partners:

  • imec
  • FiconTex
  • EVG
  • Xilinx
  • Mellanox
  • X-Celeprint
  • Innolume
  • IHP
  • Tyndall

Objective:

  • The CALADAN project brings together a supply chain that will enable automatic wafer scale assembly of Terabit/s capable optical engines through the use of the micro transfer printing technology. SiGe BiCMOS drivers and receivers and GaAs quantum dot lasers will be integrated onto Silicon Photonic integrated circuits, fully at the wafer level.

INTEC's Role:

  • Develop transfer printing processes for GaAs QD lasers on iSIPP50G

Project Web site: http://www.caladan.tech/homepage.php

People involved

Research topics involved

Publications in the framework of this project (9)

    International Journals

  1. E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens, Micro-Transfer-Printed Narrow-Linewidth III-V-on-Si Double Laser Structure with Combined 110 nm Tuning Range, Optics Express, 30(22), p.39329-39339 doi:10.1364/OE.470497 (2022).
      International Conferences

    1. E. Soltanian, G. Muliuk, S. Uvin, D. Wang, G. Lepage, P. Verheyen, J. Van Campenhout, S. Ertl, J. Rimbock, N. Vaissiere, D. Neel, J. Ramirez, J. Decobert, B. Kuyken, J. Zhang, G. Roelkens, Narrow-Linewidth Micro-Transfer-Printed III-V-on-Si Laser with 110 nm Tuning Range, 2022 IEEE Photonics Society Summer Topicals Meeting Series (SUM) (invited), Mexico, p.paper TuG2.1-1 (2 pages) doi:10.1109/SUM53465.2022.9858218 (2022).
    2. J. Zhang, C.J. Krückel, B. Haq, B. Matuskova, J. Rimmbock, S. Ertl, A. Cocalinska, E. Pelucchi, B. Corbett, J. Van Campenhout, G. Lepage, P. Verheyen, D. Van Thourhout, R. Beats, G. Roelkens, Lossless High-speed Silicon Photonic MZI switch with a Micro-Transfer-Printed III-V amplifier, The Electronic Components and Technology Conference (ECTC) 2022, United States, p.441-445 (2022)  Download this Publication (1.5MB).
    3. J. Zhang, I. Krestnikov, R. Loi, P. Ossieur, G. Lepage, P. Verheyen, J. Van Campendhout, D. Van Thourhout, G. Roelkens, Micro-Transfer-Printed O-band GaAs QD III-V-on-Si DFB Laser , European Conference on Integrated Optics, Italy, p.paper W.P.13 (3 pages) (2022)  Download this Publication (2.1MB).
    4. A. Uzun, F. Atar, J. Justice, R. Loi, A. Farrell, P. Ossieur, J. Zhang, G. Roelkens, I. Krestnikov, J. Rimbock, B. Corbett, Integration of quantum dot lasers with SOI waveguides using Micro-Transfer printing, European Conference on Integrated Optics, Italy, p.paper T.E.4 (3 pages) (2022)  Download this Publication (4.1MB).
    5. J. Zhang, E. Soltanian, B. Haq, S. Ertl, J. Rimboeck, B. Matuskova, E. Pelucchi, A. Gocalinska, J. Van Campenhout, G. Lepage, P. Verheyen, W. Bogaerts, G. Roelkens, Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser, Optical Fiber Communication Conference, p.Tu2D.2 doi:10.1364/OFC.2022.Tu2D.2 (2022)  Download this Publication (1.8MB).
    6. J. Zhang, C. Op de Beeck, B. Haq, S. Cuyvers, A. Hermans, J. De Witte, E. Soltanian, A. Gocolinska, E. Pelucchi, B. Corbett, A. J. Trindate, C. Bowers, J. Van Campenhout, G. Lepage, P. Verheyen, III-V-on-Si/SiN lasers realized using micro-transfer printing, SPIE photonics west (invited), (2021).
    7. R. Baets, The profileration of heterogeneous integration approaches in silicon(nitride) integrated photonics, SPIE Photonics West Conference (invited), 11284, United States, (2020)  Download this Publication (3.4MB).