| Authors: | D. Wang, T. N. L Tran, S. Poelman, T. Reep, M. Kiewiet, T. Vanackere, T. Vandekerckhove, M. Niels, K. Akritidis, J. De Witte, I. Luntadila Lufungula, M. Billet, J. Zhang, G. Roelkens, B. Kuyken | | Title: | Heterogeneous Integration of Active and Nonlinear Devices on Si₃N₄ Platform Using Micro-Transfer Printing | | Format: | International Conference Presentation | | Publication date: | 4/2026 | | Journal/Conference/Book: | IEEE Silicon Photonics Conference
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Abstract
Micro-transfer printing (uTP) technology enables precise and scalable back-end heterogeneous integration. By combining Si₃N₄'s ultra-low loss with the intrinsic properties of GaAs, InP, and LiNbO3, uTP enhances PICs' versatility. This talk highlights recent progress on integrated lasers, modulators and nonlinear TFLN devices on Si₃N₄ platform. Related Research Topics
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