Authors:	K.S. Kaur, A. Subramanian, P. Cardile, R. Verplancke, J. Van Kerrebrouck, S. Spiga, R. Meyer, J. Bauwelinck, R. Baets, G. Van Steenberge
Title:	Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms
Format:	International Journal
Publication date:	10/2015
Journal/Conference/Book:	Optics Express
Editor/Publisher:	OSA,
Volume(Issue):	23(22) p.28264
DOI:	10.1364/OE.23.028264
Citations:	44 (Dimensions.ai - last update: 14/4/2024) 24 (OpenCitations - last update: 19/4/2024) Look up on Google Scholar
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Abstract

This article presents the flip-chip bonding of vertical-cavity surface-emitting lasers (VCSELs) to silicon grating couplers (GCs) via SU8 prisms. The SU8 prisms are defined on top of the GCs using non-uniform laser ablation process. The prisms enable perfectly vertical coupling from the bonded VCSELs to the GCs. The VCSELs are flip-chip bonded on top
of the silicon GCs employing the laser-induced forward transfer (LIFT)-assisted thermocompression technique. An excess loss of < 1 dB at 1.55 µm
measured from the bonded assemblies is reported in this paper. The results of high speed transmission experiments performed on the bonded assemblies with clear eye openings up to 20 Gb/s are also presented