Authors: | G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets, R. Notzel, M. Smit | Title: | Adhesive Bonding of InP/InGaAsP Dies to Processed Silicon-on-Insulator Wafers using DVS-bis-Benzocyclobutene | Format: | International Journal | Publication date: | 11/2006 | Journal/Conference/Book: | Journal of Electrochemical Society
| Volume(Issue): | 153(12) p.G1015-G1019 | DOI: | 10.1149/1.2352045 | Citations: | 111 (Dimensions.ai - last update: 29/9/2024) 91 (OpenCitations - last update: 3/5/2024) Look up on Google Scholar
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