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Authors: G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets
Title: Adhesive bonding of III-V dies to processed SOI using BCB for photonic applications
Format: International Conference Proceedings
Publication date: 9/2006
Journal/Conference/Book: 210th Electrochemical Society meeting
Location: Cancun, Mexico
Internal Reference: [N-543]
Download: Download this Publication (451KB) (451KB)

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