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Authors: O. Rits, R. Bockstaele, R. Baets
Title: Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip
Format: International Conference Proceedings
Publication date: 12/2004
Journal/Conference/Book: IEEE Leos Benelux
Volume(Issue): p.279-282
Location: Ghent, Belgium
Internal Reference: [N-347]
Download: Download this Publication (188KB) (188KB)

Abstract

Inter-Chip Optical Interconnects are viable alternatives for conventional copper wires. However, the costly assembly and packaging process is the major obstacle to their commercial breakthrough, where especially the coupling of optical components seems to be the most critical aspect.
This paper describes the packaging and 3-D coupling scheme we have developed for a 2-D parallel optical interconnect module with on-chip access. It is a passive index alignment method that measures the coordinates of alignment features to achieve correct alignment. We belief it is a possible low cost solution as full automation is possible.

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