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IST: IOFull Name: Interconnect by Optics Duration: 1/9/2001-1/8/2004 (Finished) Partners: - IMEC participates in this project with three groups:
- Ghent University, department of Information Technology (INTEC)
- Ghent University, department of ELIS, TFCG group
- Ghent University, department of ELIS, Paris group
- Alcatel Bell N.V.
- Avalon Photonics Ltd
- Opto Speed SA
- Helix AG
- FCI 's hertogenbosch, more specific the Fiber optic division.
- Nexans
- R.C.I
- PPC Electronic AG
- Commisariat à l'Energie Atomique CEA (LETI), more specific the optronic department.
Objective: - We will develop an optical interconnect family for a high data rate, 2D array optical interconnect between ICs, applicable at the IC-access, board level and at the board-to-board level. The approach is based on optical waveguides that are integrable with printed circuit boards, either as a post-solder build-up extension or as a solder-compatible optical layer. The optical waveguides will be based on novel Plastic Optical Fibres, and on advanced layered Glass Sheets with waveguides. Key target parameters aimed for are: channel density from 16/mm 2 (first generation) to 64/mm 2 , number of channels (at optical interfaces) ranging from 64 (first generation), to 256, data rate between 1.25 Gb/s and 2.5 Gb/s or higher. We will demonstrate a complete optical interconnect technology family in a major application area, being that of core IP routers.
INTEC's Role: - Prime contractor
- Development of packaginig techniques for optical interface to CMOS IC
- Modelling of parallel optical interconnections
Project Web site: http://www.intec.rug.ac.be/IO People involved
Research topics involved
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Publications in the framework of this project (8)
International Conferences
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O. Rits, R. Bockstaele, R. Baets,
Packaging solution with a 3-dimensional coupling scheme for direct optical interconnects to the chip, IEEE Leos Benelux, Belgium, p.279-282 (2004)
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M. De Wilde, O. Rits, R. Bockstaele, J. Van Campenhout, R. Baets,
A circuit-level simulation approach to analyse system level behaviour of VCSEL-based optical interconnects, VCSELs and Optical Interconnects. Proceedings of SPIE. Vol. 4942. 2003. , p.247-257 doi:10.1117/12.471929 (2003).
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M. De Wilde, O. Rits, R. Bockstaele, R. Baets, J. Van Campenhout,
Design Methodology Development for VCSEL-based Guided-Wave Optical Interconnects, Proceedings of the 7th IEEE Workshop on Signal Propagation on Interconnects. IEEE. 2003. , p.137-138 (2003).
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H. Lambrecht, R. Bockstaele, R. Baets,
Self-Written Waveguides in polymeric materials, IEEE LEOS Benelux, (2003).
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R. Bockstaele, I. Popov, S. Eitel, M. Klemenc, R. Annen, J. Van Koetsem, G. Widawski, P. Straub, P. Le Moine, F. Marion, R. Baets,
A low-cost parallel optical interconnect system: the IO link, IEEE/LEOS Benelux Chapter, (2003).
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M. De Wilde, O. Rits,
Design methodology development for guided-wave optical interconnects, Design, Automation and Test in Europe. 2003, (2003).
National Conferences
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R. Bockstaele,
Interconnect by Optics, Project overview & Work on Plastic Optical Fibre, POFAC Fachgruppentreffen (invited), Germany, (2004).
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R. Bockstaele, et al.,
A low-cost parallel optical interconnect system: the IO link, RMA workshop on POF, (2003).
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