| Authors: | K. Shortiss, H.-Y. Hwang, J. Parra, S. Butler, H.-C. Wang, M. Ghomashi, Y. Li, W. Noell, M. Seyfried, P. O'Brien | | Title: | Automating Photonic Systems-in-Package Assembly for High Performance Glass Interposers | | Format: | International Conference Proceedings | | Publication date: | 9/2024 | | Journal/Conference/Book: | 50th European Conference on Optical Communication
| | Volume(Issue): | p.W2A.33 | | Location: | FRANKFURT, Germany | | Citations: | Look up on Google Scholar
| | Download: |
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Abstract
Interest in high performance glass interposers has been growing, due to the advantages which have been demonstrated over standard silicon interposers. In this paper, we demonstrate fully auto-mated micro-optics and laser sub-assembly alignment and laser-assisted bonding processes which are compatible with glass interposers Related Research Topics
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