| Authors: | T. Ma, L. Yang, Y. Li, Y. Du | | Title: | Non-Contact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects | | Format: | International Journal | | Publication date: | 1/2025 | | Journal/Conference/Book: | IEEE Transactions on Components, Packaging and Manufacturing Technology
| | Volume(Issue): | 15(1) p.232-234 | | DOI: | 10.1109/TCPMT.2024.3511042 | | Citations: | Look up on Google Scholar
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