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Authors: R. Baets, G. Roelkens
Title: Heterogeneous Integration in Silicon Photonics
Format: International Conference Presentation
Publication date: 5/2021
Journal/Conference/Book: Conference on Silicon Photonics (invited)
Editor/Publisher: Chinese Society for Optical Engineering (CSOE), 
Location: Chongqing, China
Citations: Look up on Google Scholar


Silicon photonics is emerging as a generic photonic integration platform technology and it serves a broad variety of applications, from telecom/datacom and computing to sensing and medical. In many of those applications there is a need to enrich the basic silicon (or silicon nitride) waveguide platform with functions based on overlay add-on materials, for improved performance or squarely new functionalities. The list of such new materials is long and so is the list of technologies to bring them on top of silicon. This heterogeneous integration trend is somewhat in conflict with the need for standardization as needed to drive maturity up and cost down. Therefore a key question is how to build supply chains that combine the rich functionality of new materials for silicon photonics with manufacturing platforms with critical mass. This presentation will discuss the challenge and propose possible solutions.

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