| Authors: | P. Bakopoulos, D. Kalavrouziotis, E. Mentovich, P. Ossieur, G. Roelkens, J. Van Campenhout | | Title: | Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects | | Format: | International Conference Proceedings | | Publication date: | 6/2019 | | Journal/Conference/Book: | PhotonIcs & Electromagnetics Research Symposium (PIERS)
(invited)
| | Location: | Rome, Italy | | Citations: | Look up on Google Scholar
|
|
|
