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Authors: S. Keyvaninia, M. Muneeb, S. Stankovic, S. Ghosh, M. Tassaert, D. Van Thourhout, G. Roelkens
Title: DVS-BCB Adhesive Bonding for Silicon Photonics
Format: International Conference Proceedings
Publication date: 12/2013
Journal/Conference/Book: Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration (WaferBond ‘13) (invited)
Location: Stockholm, Sweden
Citations: Look up on Google Scholar
Download: Download this Publication (614KB) (614KB)


A new process for bonding of III-V dies to processed silicon-on-insulator waveguide circuits using divinylsiloxane-bis-benzocyclobutene (DVS-BCB) was developed using a commercial wafer bonder. High-quality bonding, with ultra-thin bonding layers (< 50 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers and photodetectors.

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