Authors: | J.-M. Fedeli, F. Schrank, W. Bogaerts, A. Masood, L.Zimmermann, E. Augendre, S. Bernabe, J. Kraft, P. Grosse, T. Enot | Title: | Electronic-Photonic Integration in the Helios Project | Format: | International Conference Proceedings | Publication date: | 8/2013 | Journal/Conference/Book: | Group IV Photonics
(invited)
| Editor/Publisher: | IEEE, | Volume(Issue): | p.FB1 | Location: | Seoul, South Korea | DOI: | 10.1109/group4.2013.6644413 | Citations: | 1 (Dimensions.ai - last update: 8/12/2024) Look up on Google Scholar
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Abstract
Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side integration. Type and volume applications are selection criteria Related Research Topics
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