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Authors: S. Keyvaninia, M. Muneeb, S. Stankovic, G. Roelkens, D. Van Thourhout, J.M. Fedeli
Title: Multiple die-to-wafer adhesive bonding for heterogeneous integration
Format: International Conference Proceedings
Publication date: 4/2012
Journal/Conference/Book: 16th European Conference on Integrated Optics (ECIO 2012)
Volume(Issue): p.paper 186
Location: Barcelona, Spain
Citations: Look up on Google Scholar
Download: Download this Publication (264KB) (264KB)


A new process for bonding of 111-V dies to processed
silicon-on-insulator waveguide circuits using divynilsiloxane-bisbenzocycJobutene
(DVS-BCB) was developed using a commercial
wafer bonder. High-quality bonding, with ultra-thin bonding layers « 60 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers.

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