| Authors: | S. Selvaraja, E.Rosseel, L.Fernandez, Martin Tabat, W. Bogaerts, J. Hautala, P. Absil | | Title: | SOI Thickness Uniformity Improvement using Corrective Etching for Silicon Nano-Photonic Device | | Format: | International Conference Poster | | Publication date: | 9/2011 | | Journal/Conference/Book: | 8th International Conference on Group IV Photonics
| | Editor/Publisher: | IEEE Photonics Society , | | Volume(Issue): | p.71-73 | | Location: | London , United Kingdom | | DOI: | 10.1109/group4.2011.6053719 | | Citations: | 21 (Dimensions.ai - last update: 21/12/2025)
8 (OpenCitations - last update: 3/5/2025)
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Abstract
We present our recent results on Si thickness uniformity improvement in a SOI wafer. We improved the thickness uniformity by 50%. The effect of the correction process on the propagation loss and device uniformity is also presented. Related Research Topics
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