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Authors: J.M. Fedeli, E. Augendre, J.-M. Hartmann, L. Vivien, P. Grosse, V. Mazzocchi, W. Bogaerts, D. Van Thourhout, F. Schrank
Title: Photonics and Electronics Integration in the HELIOS project
Format: International Conference Proceedings
Publication date: 9/2010
Journal/Conference/Book: Group IV Photonics 2010
Volume(Issue): p.FC2
Location: Beijing, China
DOI: 10.1109/group4.2010.5643326
Citations: 11 ( - last update: 14/7/2024)
7 (OpenCitations - last update: 3/5/2024)
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The objective of the European project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics processes. Bonding of AWG + Ge Photodiodes on CMOS wafer is achieved.

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