| Authors: | A. Masood, W. Bogaerts, J. Van Olmen, J. Van Aelst, D. Van Thourhout, D. Sabuncuolu Tezcan |
| Title: | Photonics-CMOS 3D integration: copper through-silicon-via approach |
| Format: | International Conference Proceedings |
| Publication date: | 11/2009 |
| Journal/Conference/Book: | Proceedings of the 2009 Annual Symposium of the IEEE Photononics Benelux Chapter
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| Volume(Issue): | p.165-168 |
| Location: | Brussels, Belgium |
| Citations: | Look up on Google Scholar
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| Download: |
 (329KB) |
