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Authors: G. Roelkens, J. Brouckaert, L. Liu, J. Van Campenhout, F. Van Laere, D. Van Thourhout, R. Baets
Title: Wafer bonding and heterogeneous integration: technology and integrated devices
Format: International Conference Proceedings
Publication date: 8/2008
Journal/Conference/Book: ECIO (invited)
Location: Eindhoven, Netherlands
Citations: Look up on Google Scholar
Download: Download this Publication (1MB) (1MB)

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