| Authors: | L. Zimmermann, T. Tekin, H. Schröder, P. Dumon, W. Bogaerts | | Title: | ePIXpack - Advanced Smart Packaging Solutions for Silicon Photonics | | Format: | International Conference Proceedings | | Publication date: | 6/2008 | | Journal/Conference/Book: | European Conference on Integated Optics (ECIO 2008)
| | Volume(Issue): | p.WeB2 | | Location: | Eindhoven, Netherlands | | Citations: | Look up on Google Scholar
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Abstract
We introduce two Silicon photonics packages to be used in future applications requiring multiple optical & electrical i/o. One package is based on a fiber array to assure small footprints. The other package provides configurable optical & electrical connectivity. Both packages are built using commercially available parts. Related Projects
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