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Authors: C. Rooman, M. Kuijk, R. Windisch, R. Vounckx, G. Borghs, A. Plichta, M. Brinkman, K. Gerstner, R. Strack, P. Van Daele, W. Woittiez, R. Baets, P. Heremans
Title: Inter-Chip optical interconnects using imaging fiber bundles and integrated CMOS detectors
Format: International Conference Proceedings
Publication date: 10/2001
Journal/Conference/Book: ECOC 01
Volume(Issue): p.296-297
Location: Amsterdam, Netherlands
DOI: 10.1109/ecoc.2001.989635
Citations: 8 (Dimensions.ai - last update: 22/1/2023)
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