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Authors: K. Shortiss, H.-Y. Hwang, J. Parra, S. Butler, H.-C. Wang, M. Ghomashi, Y. Li, W. Noell, M. Seyfried, P. O'Brien
Title: Automating Photonic Systems-in-Package Assembly for High Performance Glass Interposers
Format: International Conference Poster
Publication date: 12/2023
Journal/Conference/Book: 50th European Conference on Optical Communication
Location: FRANKFURT, Germany
Citations: Look up on Google Scholar

Abstract

Interest in high performance glass interposers has been growing, due to the advantages which have been demonstrated over standard silicon interposers. In this paper, we demonstrate fully auto-mated micro-optics and laser sub-assembly alignment and laser-assisted bonding processes which are compatible with glass interposers


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