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Authors: E.P. Haglund, S. Kumari, J. Goyvaerts, J.S. Gustavsson, R. Baets, G. Roelkens, A. Larsson
Title: Vertical-Cavity Silicon-Integrated Lasers by Bonding and Transfer Printing
Format: International Conference Proceedings
Publication date: 11/2018
Journal/Conference/Book: IEEE International Semiconductor Laser Conference (ISLC)
Editor/Publisher: IEEE, 
Volume(Issue): p.241-242
Location: Santa Fe, United States
DOI: 10.1109/ISLC.2018.8516256
Citations: 2 (Dimensions.ai - last update: 29/9/2024)
1 (OpenCitations - last update: 27/6/2024)
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Abstract

We present the design and performance of the first current-driven hybrid-vertical-cavity silicon-integrated laser with in-plane waveguide emission. We also show results from preliminary work on transfer printing for large-scale integration of such light soures on silicon photonic integrated circuits.

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