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Authors: N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, B. Snyder
Title: Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
Format: International Conference Proceedings
Publication date: Accepted for publication. Not yet published
Journal/Conference/Book: OFC 2018
Location: United States

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