| Authors: | N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, B. Snyder | | Title: | Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics | | Format: | International Conference Proceedings | | Publication date: | 3/2018 | | Journal/Conference/Book: | The Optical Fiber Communication Conference (OFC)
| | Volume(Issue): | p.paper Tu2A.1 (3 pages) | | Location: | San Diego, United States | | DOI: | 10.1364/ofc.2018.tu2a.1 | | Citations: | 6 (Dimensions.ai - last update: 14/4/2024)
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