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Authors: G. Muliuk, N. Ye, D. Van Thourhout, G. Roelkens
Title: High Alignment Accuracy Transfer Printing of Silicon Coupons for Heterogeneously Integrated PICs
Format: International Conference Proceedings
Publication date: 11/2017
Journal/Conference/Book: Proceedings Symposium IEEE Photonics Society Benelux
Volume(Issue): p.48-51
Location: Delft, Netherlands
Internal Reference: [N-2128]
Download: Download this Publication (263KB) (263KB)

Abstract

A process flow is developed for releasing and transfer printing silicon-on-insulator devices. High alignment accuracy (better than ±1um) transfer printing of silicon coupons is demonstrated. Transfer printing alignment markers on source coupons and target wafers were used in a center-to-center alignment method. Notches on the sides of the devices and on the target were implemented for measuring misalignment using scanning electron microscopy. This work proves that transfer-printing technology can be used for the scalable heterogeneous integration of silicon photonic devices with optical interfaces allowing for a +/- 1μm misalignment.

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