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Authors: S. Ghosh, S. Keyvaninia, W. Van Roy, T. Mizumoto, G. Roelkens, R. Baets
Title: Demonstration of a Ce:YIG/SOI isolator by BCB bonding
Format: International Conference Proceedings
Publication date: 12/2011
Journal/Conference/Book: 16th Annual Symposium of the IEEE Photonics Benelux Chapter
Volume(Issue): p.33-36
Location: Ghent, Belgium
Internal Reference: [N-1197]
Download: Download this Publication (512KB) (512KB)

Abstract

We demonstrate an optical isolator on a Silicon-on-insulator platform realized by adhesive BCB bonding. A Ce:YIG die was manually bonded on top of a Mach-Zehnder interferometer (MZI) using a 100nm thick BCB bonding layer. Experimentally a maximum isolation of 25dB was obtained. The insertion loss of the bonded device is about 8dB. The nonreciprocal phase shift (NRPS) induced by the Ce:YIG with the aid of an external magnetic field matches with simulation. The simulation, design and experimental results are presented in this paper.


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