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Authors: K. Van Acoleyen, H. Rogier, R. Baets
Title: Chip-to-chip Optical Wireless Link Feasibility Using Optical Phased Arrays on Silicon-On-Insulator.
Format: International Conference Poster
Publication date: 5/2010
Journal/Conference/Book: 7th International Conference on Group IV Photonics
Editor/Publisher: IEEE, 
Volume(Issue): (2010) p.FC7
Location: Beijing, China
Internal Reference: [N-1024]
Download: Download this Publication (334KB) (334KB)

Abstract

One- and two-dimensional integrated optical phased arrays (OPAs) on silicon-on-insulator have been fabricated and measured having directivities of more than 40dBi and steering ranges up to 10 degrees. These OPAs would allow data rates of 100Mbps at distances up to 0.5m.

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