Authors:	G. Roelkens, J. Brouckaert, L. Liu, J. Van Campenhout, F. Van Laere, D. Van Thourhout, R. Baets
Title:	Wafer bonding and heterogeneous integration: technology and integrated devices
Format:	International Conference Proceedings
Publication date:	8/2008
Journal/Conference/Book:	ECIO (invited)
Location:	Eindhoven, Netherlands
Citations:	Look up on Google Scholar
Download:	(1MB)

Related Research Topics

• Die-to-wafer bonding technology (2003-2012)