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Publication detail
Authors:
G. Roelkens
,
J. Brouckaert
,
J. Van Campenhout
,
D. Van Thourhout
,
R. Baets
Title:
III-V/Silicon photonics for optical interconnects: bonding technology and integrated devices
Format:
International Conference Proceedings
Publication date:
6/2007
Journal/Conference/Book:
Frontiers in Optics
(invited)
Location:
San Jose, United States
DOI:
10.1364/fio.2007.fthh3
Citations:
1
(Dimensions.ai - last update: 13/10/2024)
1
(OpenCitations - last update: 3/5/2024)
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Related Research Topics
Die-to-wafer bonding technology (2003-2012)
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