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Authors: G. Roelkens, D. Van Thourhout, I. Christiaens, R. Baets, M.K. Smit
Title: Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components
Format: International Conference Presentation
Publication date: 4/2005
Journal/Conference/Book: ECIO 2005
Location: Grenoble, France
Internal Reference: [N-373]
Download: Download this Publication (802KB) (802KB)

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